Our Products

Dicing Fluid

Dicing Fluid

Description

Designed for the electronics industry and can be used in a wide range of cutting processes.

The potential benefits of adding clean dice into any singular process are as follows:
Product advantages. Less die rejects from wafer
Increase product quality
Reduce surface tension.
Extent Saw Blade life
Improved ball/bond strength
100% water soluble and Non-Toxic

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Ure-shii Technologies providing Cleanroom and ESD consumables, tooling, and fabrication solutions for the industry.

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