Rubber Cleaner

C60 Series group of mold-die cleaning rubber sheets designed to remove mold stains such as epoxy resin and organic residues from mold surfaces and deep cavities during semiconductor transfer molding. It eliminates the need for dummy lead frames and reduces costs by simplifying the cleaning process through compression molding.

C60-U (Puller) – removes mold stains and restores mold-die surface cleanliness by decomposing residues through dissolving, wrapping, and grinding actions.
C60-KA (Softener) – reduces mold stain adhesion to metal surfaces using cleaning agents and removes residues by polymer cross-linking at high temperature.